Bionic ceramic wick offers breakthrough in heat management for high-power electronics

Researchers at the University of Science and Technology of China, led by Professor Ye Hong, have developed an innovative heat management technology for high-power electronic chips. This revolutionary advancement, inspired by the natural processes in plant leaves, could significantly enhance the efficiency and sustainability of AI data centres.

Published in the journal Langmuir, the research introduces a bionic ceramic wick for Loop Heat Pipes (LHPs) that mimics the transpiration mechanisms of leaf stomata. This breakthrough addresses a longstanding issue faced by traditional LHPs, which rely on wicks with consistent pore sizes. Such uniformity often leads to inefficiencies, particularly at high heat fluxes, due to vapour blockages and increased thermal resistance.

The bionic wick is designed with an asymmetric pore structure that optimises heat transfer, effectively mitigating the challenges associated with conventional systems. This design features straight, finger-like pores that function as vapour channels, thereby reducing vapour transport resistance and improving heat dissipation capabilities. Additionally, the choice of ceramics over metals for constructing these wicks provides enhanced corrosion resistance and thermal stability, essential for the long-term functionality of high-performance electronic devices.

A noteworthy aspect of this technology is its manufacturing process, which utilizes phase-inversion tape casting. This method, traditionally used for crafting porous ceramic membranes, enables the creation of multiscale pore structures in a single step, ensuring consistent and robust production.

Initial experiments integrating the bionic wick into LHP systems yielded promising results. By fine-tuning the balance between capillary force and flow resistance, the wick demonstrated efficient fluid transport, significantly boosting the system’s thermal performance. This innovation heralds potential applications beyond computing, with significant implications for the aerospace, microelectronics, and energy industries.

As AI-driven data centres continue to evolve, efficient thermal management becomes increasingly critical. The bionic wick developed by Ye Hong’s team presents a viable solution to this problem, offering a glimpse into future advancements that leverage natural designs to meet technological demands. Researchers are optimistic that this pioneering approach will catalyse further development, ultimately leading to smarter and greener electronics.

Source: Noah Wire Services